PARBOND 101
Fast cure all purpose adhesive designed to bond a wide variety of surfaces.
Request current TDS04 / Epoxy & polyurethane adhesives
For structural joints, seam sealing, and selected potting or encapsulation work. Match the mixing and cure process to the specific grade.
PARBOND epoxy ranges include 1:1 and 2:1 two-component systems, alongside single-part epoxy grades. The catalogue also contains polyurethane adhesives, seam sealers and potting or encapsulating products used around electronic and industrial components. These are different processing choices: a structural joint, a seam and a filled enclosure do not have the same dispensing or cure requirements. Compare the exact grade for mixing method, viscosity, working time, fixture or cure schedule, and compatibility with the substrates and components in the finished assembly.


APPLICATIONS
PARBOND combines epoxy and polyurethane technologies for structural bonding, seam sealing, potting and encapsulation. Its catalogue spans two-component systems, selected one-component epoxies and different working-time and viscosity options for assembly and component protection.
Fast cure all purpose adhesive designed to bond a wide variety of surfaces.
Request current TDSAll purpose high strength adhesive with 5 min working time. Excellent adhesion to wide variety of surfaces.
Request current TDSAll purpose high performance adhesive with medium cure speed. Excellent adhesion to wide variety of surfaces.
Request current TDSAll purpose high performance adhesive with 30-minute working time. Excellent adhesion to wide variety of surfaces (Low odor version of Parbond 300).
Request current TDSVery flexible seam sealer with excellent resistance properties.
Request current TDSFast-curing polyurethane adhesive used for automotive bumper and plastic repair.
Request current TDSFast curing polyurethane with a 5-minute worklife. General-purpose plastic assembly and repair application.
Request current TDSMedium curing polyurethane with 20 minutes work life. Excellent adhesion to difficult to bond plastics, metals, glass & wood.
Request current TDSSlow curing polyurethane with 50 minutes work life. Excellent adhesion to difficult to bond composites, plastics, metals & glass.
Request current TDSWidely used for general purpose bonding applications.
Request current TDSExcellent adhesion on wide variety of surfaces with long working time.
Request current TDSHigh performance industrial assembly adhesive with exceptional durability.
Request current TDSA potting and encapsulating compound with good electrical properties.
Request current TDSRubber toughened, high strength with high peel and shear.
Request current TDSQuick Metal repair and assembly adhesive with high strength.
Request current TDSThis is a 100% reactive epoxy adhesive cures rapidly at room temperature. It’s a metal bonding adhesive which develops high strength in a short time.
Request current TDSOne component epoxy adhesives in the PARBOND range. Review the grade’s application details and technical documentation.
Technical data on requestFlip-chip applications on aluminum antennas.
Request current TDSA potting and encapsulating grade for the electronic industry.
Request current TDSTry a shorter product code, another material or reset the filters.
Discuss your applicationCONTACT PARSON
Share your materials, joint and process requirements with our India team.
Discuss an applicationsales@parsonadhesives.in