Chip encapsulation
PARLITE 4713
Ideal for Chip on Board,Chip on Flex, Chip on Glass, Wire bonding, Bare-die encapsulation.
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Chip encapsulation
PARLITE includes UV and visible-light-curing adhesives for bonding, sealing, coating, tacking and encapsulation. Catalogue applications cover glass, selected plastics and metals, optical and electronic assembly, windshield repair, and specialist device-component bonding. Explore the chip encapsulation range below.
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Chip encapsulation
PARLITE 4716
Higher viscosity version of Parlite 4713. Low modulus for wire bonding application.
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