Chip encapsulation
PARLITE 4713
Ideal for Chip on Board,Chip on Flex, Chip on Glass, Wire bonding, Bare-die encapsulation.
Request current TDS
PARLITE FAMILY SHOWN / PACKAGING VARIES BY GRADEPARLITE / Chip encapsulation
PARLITE 4716
Higher viscosity version of Parlite 4713. Low modulus for wire bonding application.
Request current TDSUV-curable adhesivesIndustrial use
Selection depends on the actual materials, joint and service conditions. Confirm suitability before use.
APPLICATION / SELECTION
What to check
before selecting.
Selection considerations for PARLITE 4716
Review component clearances, sensitive connections and where the encapsulant must flow or remain confined. Confirm the dispensing and curing method, including access around shadowed features, then validate the finished assembly for the relevant electrical and mechanical requirements.
Read the selection guide01 / TECHNICAL OVERVIEW
Technical properties
Typical properties from the available product literature. Values are tied to the stated test conditions and do not replace the current technical data sheet.
| Viscosity @25°C (cps) | 15,000– 20,000 cps |
|---|---|
| Elongation at Break (%) | 140–160 |
| Modulus of Elasticity (psi) | 2,500–3,000 |
| Color | Clear |
| Shore Hardness | 50D |
Where data is incomplete or inconsistent across source documents, a value is not shown. Request the current TDS for final selection.
02 / DOCUMENTATION
Request documentation
Request the current TDS, safety data sheet or catalogue. Our team will confirm the relevant document and respond to your enquiry.
Need the current technical data sheet?
Include PARLITE 4716 in your application brief and request the current grade-specific documentation.
Request technical dataSAFETY DOCUMENTATIONRequest the safety data sheetConfirm handling, storage and safety information with our team.
PDF / PRODUCT CATALOGUERequest the Parson product catalogueOriginal catalogue • specifications and availability subject to confirmation
03 / BEFORE YOU SPECIFY
A product is part
of a process.
- 01Identify the exact substrates and surface condition.
- 02Define joint geometry, operating conditions and process time.
- 03Review the current TDS and safety data before handling.
- 04Validate the adhesive on representative assemblies.
CONTINUE EXPLORING
Related grades.
All PARLITE productsCONTACT PARSON
Make the next
connection.
Tell us how you plan to use PARLITE 4716. Share the details that matter to your assembly.
Discuss an applicationsales@parsonadhesives.in