Electronic assembly
PARLITE 4710
High viscosity encapsulant for precision application to specific electronic assembly areas, glob top application.
Request current TDS
PARLITE FAMILY SHOWN / PACKAGING VARIES BY GRADEPARLITE / Electronic assembly
PARLITE 4019
UV-curable adhesive. Request current technical data for application selection.
Request current TDSUV-curable adhesivesIndustrial use
Selection depends on the actual materials, joint and service conditions. Confirm suitability before use.
APPLICATION / SELECTION
What to check
before selecting.
Selection considerations for PARLITE 4019
Identify the component materials, sensitive areas and required coverage before selecting a grade. Confirm dispensing and cure access, including any shadowed regions, and establish the electrical, thermal and mechanical checks needed for the complete assembly.
Read the selection guide01 / TECHNICAL OVERVIEW
Technical properties
Typical properties from the available product literature. Values are tied to the stated test conditions and do not replace the current technical data sheet.
Grade-specific numerical properties are available on request. Share your application requirements to obtain the appropriate current technical data.
Where data is incomplete or inconsistent across source documents, a value is not shown. Request the current TDS for final selection.
02 / DOCUMENTATION
Request documentation
Request the current TDS, safety data sheet or catalogue. Our team will confirm the relevant document and respond to your enquiry.
Need the current technical data sheet?
Include PARLITE 4019 in your application brief and request the current grade-specific documentation.
Request technical dataSAFETY DOCUMENTATIONRequest the safety data sheetConfirm handling, storage and safety information with our team.
PDF / PRODUCT CATALOGUERequest the Parson product catalogueOriginal catalogue • specifications and availability subject to confirmation
03 / BEFORE YOU SPECIFY
A product is part
of a process.
- 01Identify the exact substrates and surface condition.
- 02Define joint geometry, operating conditions and process time.
- 03Review the current TDS and safety data before handling.
- 04Validate the adhesive on representative assemblies.
CONTINUE EXPLORING
Related grades.
All PARLITE productsElectronic assembly
PARLITE 4760
Potting, Encapsulating, bonding of electronic parts.
Request current TDSCONTACT PARSON
Make the next
connection.
Tell us how you plan to use PARLITE 4019. Share the details that matter to your assembly.
Discuss an applicationsales@parsonadhesives.in