Smart card encapsulation
PARLITE 4741
Speaker assembly, plastic housing assembly, flexible plastic lamination, appliance assembly.
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PARLITE includes UV and visible-light-curing adhesives for bonding, sealing, coating, tacking and encapsulation. Catalogue applications cover glass, selected plastics and metals, optical and electronic assembly, windshield repair, and specialist device-component bonding. Explore the smart card encapsulation range below.
Explore PARLITESpeaker assembly, plastic housing assembly, flexible plastic lamination, appliance assembly.
Request current TDSEncapsulant for smart card technology. Dam for Dam & Fill.
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