Parlite UV curable Adhesives are used for various Electronics Adhesives Selection Guide Devices and applications, assemblies. It extends solutions for Potting and encapsulation for electronic parts.
| Grade | Substrates | Viscosity @ 25 °C | Shore Hardness | Elongation | Cure | Tensile | Application |
| 4710 | Metals, Plastics, Ferrite | 17,000 cps | 45D | 90% | UV, Visible or Heat | 1,000 psi | High viscosity encapsulant for precision application to specific electronic assembly areas, glob top application. |
| 4019 | Metals, Plastics, Ferrite | 600 cps | 55D | 72% | UV, Visible or Heat | 750 psi | Specifically designed for potting. Bonds with light adhesion: for connectors, thermal switches, temper proofing. |