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Electronic Adhesives Selection Guide

Parlite UV curable Adhesives are used for various Electronics Adhesives Selection Guide Devices and applications, assemblies. It extends solutions for Potting and encapsulation for electronic parts.

Grade Substrates Viscosity @ 25 °C Shore Hardness Elongation Cure Tensile Application  
4710 Metals, Plastics, Ferrite 17,000 cps 45D 90% UV, Visible or Heat 1,000 psi High viscosity encapsulant for precision application to specific electronic assembly areas, glob top application. Enquiry
4019 Metals, Plastics, Ferrite 600 cps 55D 72% UV, Visible or Heat 750 psi Specifically designed for potting. Bonds with light adhesion: for connectors, thermal switches, temper proofing. Enquiry
4025 Metals, Ceramic, Glass Filled epoxy 150 cps 85D 12% UV, Visible and Heat Clear Tough, glossy conformal coating with excellent adhesion to wide variety of boards and masks. Fast cure. Enquiry

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Why Parson

Parson Adhesives India Pvt. Ltd.

SF-4,Tower-A,Signet Plaza,

Kunal Cross Road

B/H ISCON Heights,

Gotri ,Vadodara-390021,Gujarat,India.

Phone : +91-265-2972191

Mob : +91-9428511765, +91-9426780915

Mail :